Status: Work in Progress
This repository serves as the primary workspace and documentation hub for wafer.space.
Our current padframe and wirebonding layouts follow the Tiny Tapeout convention of 74 pads. All ground (GND) connections are tied together in the Default Breakout COB package.
wafer.space completed its successful first run, delivering working chip-on-board (COB) packages to customers. The boards below are the actual COB parts that were wire-bonded and shipped as part of Run 1 — real silicon, packaged and ready to drop into a breakout motherboard.
See Run 1 for the full padframe reference, pinouts, and design requirements behind these parts.
Pinouts, connector choices, and footprint dimensions are run-specific and documented per run.
- Run 1 — padframe reference / pinouts, example COB layout, mezzanine connectors, and design requirements
We provide example breakout motherboard designs that mate with the COB packages via the 70-pin mezzanine connector. See the Motherboards directory for KiCad schematics, layouts, and symbols.
The mezzanine connector symbol provides a 1:1 pin mapping to the 70-pin default layout. You can find these symbols in the Motherboards examples. All pins are aliased to match Tiny Tapeout naming conventions.
Default 70-pin mezzanine COB breakout symbol
We also provide an alternate version that organizes pins by signal type. Ideal for Tiny Tapeout breakout motherboard designs.
Default 70-pin mezzanine COB breakout symbol TT version