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A bare unpackaged chip. A die is the square of silicon containing integrated circuits (ICs) that has been cut out of the wafer but not yet packaged. Die is singular; dice is plural. When the dice are packaged, they become chips. See MCM, wafer and chip.

Chips on a Wafer This picture of two ICs still on the wafer shows the various circuits, which have been colored for public presentation. (Image courtesy of Texas Instruments, Inc.)
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