The Taiwan Semiconductor Manufacturing Company (TSMC) was supposed to have its first Arizona chip factory operational by late 2024 but now has confirmed significant delays. Primarily due to a shortage of technical workers with critical expertise in the US, TSMC projects to finish construction instead by 2025.
This is an “ominous delay,” Bloomberg reported, and it comes right when investment in AI is booming. TSMC is a leading supplier of AI chips, and the Biden administration is scrambling to quickly expand the US domestic chip industry. But the delay wasn’t necessarily unexpected, ASML Holding NV CEO Peter Wennink told Bloomberg. Wennink’s company is one of the world’s leading producers of chipmaking equipment, and he said that getting access to skilled workers is a common cause of setbacks when building semiconductor fabrication plants, also known as fabs.
“People don’t seem to realize that when we start building those fabs across the globe now and are everywhere, that skill has been refined over the last couple of decades in only a few places on the planet—predominantly in Taiwan and in Korea and a bit in China,” said Wennink. “Getting access to the requisite skills and skilled workers to keep the construction plan on time is a challenge.”
At the end of last month, TSMC confirmed it would be sending more Taiwanese workers to the US to ensure a “fast ramp up” of its $40 billion fab in Arizona, Reuters reported. A second Arizona fab is planned to be operational by 2026— the most advanced chip factory currently in production, Reuters reported—and, at least so far, it has not been confirmed whether the first fab’s delay will result in any further delays on completing the second fab.
Ars could not immediately reach TSMC for comment. [Update: A TSMC spokesperson told Ars that it typically takes between 2.5 and three years to “build an advanced process fab of similar scale.” Construction on the Arizona fab began in 2021 with what TSMC Chairman Mark Liu described as “an aggressive schedule,” and TSMC “already finished building the shell of the building” but is now “in a phase of handling and installing the most advanced and dedicated equipment,” the spokesperson said. Completing that phase has been delayed, because Liu said, “there is an insufficient amount of skilled workers with the specialized expertise required for equipment installation in a semiconductor grade facility.”]

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